The present invention relates to a reactive adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from an initiator, in particular a radical initiator, or an activator, featuring enhanced heat-and-humidity resistance, and to a reactive 2-component adhesive system in film form for bonding diverse materials, such as, for example, metal, wood, glass and/or plastic material.