- 专利标题： Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology
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申请号： US17637144申请日： 2020-08-03
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公开(公告)号： US11901149B2公开(公告)日： 2024-02-13
- 发明人: Bernd Strütt , Dietmar Birgel , Silke Czaja
- 申请人： Endress+Hauser SE+Co. KG
- 申请人地址： DE Maulburg
- 专利权人： Endress+Hauser SE+Co. KG
- 当前专利权人： Endress+Hauser SE+Co. KG
- 当前专利权人地址： DE Maulburg
- 代理机构： Endress+Hauser (USA) Holding, Inc.
- 代理商 Mark A. Logan
- 优先权： DE 2019122611.2 2019.08.22
- 国际申请： PCT/EP2020/071818 2020.08.03
- 国际公布： WO2021/032455A 2021.02.25
- 进入国家日期： 2022-02-22
- 主分类号： H01H85/046
- IPC分类号： H01H85/046 ; H01C1/144 ; H01C1/148 ; H01H1/58
摘要：
An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
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