- 专利标题: Semiconductor structure
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申请号: US18053957申请日: 2022-11-09
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公开(公告)号: US11901306B2公开(公告)日: 2024-02-13
- 发明人: Chung-Yu Lu , Yao-Jen Chang , Sao-Ling Chiu
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 分案原申请号: US16548341 2019.08.22
- 主分类号: H01L23/544
- IPC分类号: H01L23/544 ; H01L21/308 ; H01L21/027
摘要:
Semiconductor structures are provided. A semiconductor structure includes a plurality of product regions over a semiconductor substrate, a plurality of alignment regions over the semiconductor substrate, and a plurality of first features formed in a material layer over the semiconductor substrate. Each of the alignment regions is surrounded by four of the product regions of a group, and each of the first features extends across two adjacent product regions in the group. The product regions are disposed in rows and columns of a first array, and the alignment regions are disposed in rows and columns of a second array, and the first and second arrays have a same center point.
公开/授权文献
- US20230112229A1 SEMICONDUCTOR STRUCTURE 公开/授权日:2023-04-13
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