Invention Grant
- Patent Title: Dielectric isolation layer between a nanowire transistor and a substrate
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Application No.: US17850799Application Date: 2022-06-27
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Publication No.: US11901458B2Publication Date: 2024-02-13
- Inventor: Bruce E. Beattie , Leonard Guler , Biswajeet Guha , Jun Sung Kang , William Hsu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66

Abstract:
Gate all around semiconductor devices, such as nanowire or nanoribbon devices, are described that include a low dielectric constant (“low-k”) material disposed between a first nanowire closest to the substrate and the substrate. This configuration enables gate control over all surfaces of the nanowires in a channel region of a semiconductor device via the high-k dielectric material, while also preventing leakage current from the first nanowire into the substrate.
Public/Granted literature
- US20220336668A1 DIELECTRIC ISOLATION LAYER BETWEEN A NANOWIRE TRANSISTOR AND A SUBSTRATE Public/Granted day:2022-10-20
Information query
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