- 专利标题： Temperature control in chemical mechanical polish
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申请号： US16511649申请日： 2019-07-15
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公开(公告)号： US11904430B2公开(公告)日： 2024-02-20
- 发明人: Kei-Wei Chen , Chih Hung Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： B24B37/015
- IPC分类号： B24B37/015 ; B24B37/20 ; B24B37/30 ; B24B53/017
摘要：
A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
公开/授权文献
- US20190337115A1 Temperature Control in Chemical Mechanical Polish 公开/授权日：2019-11-07
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