Invention Grant
- Patent Title: Platen with grid assembly for 3D printing
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Application No.: US17112534Application Date: 2020-12-04
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Publication No.: US11904542B2Publication Date: 2024-02-20
- Inventor: Jeff Lee Chapman , Robert Skubic , Bryan Migliori , Benjamin L Braton , Patrick W. Anderson , Josh Durand , Colin Schiel
- Applicant: Stratasys, Inc.
- Applicant Address: US MN Eden Prairie
- Assignee: Stratasys, Inc.
- Current Assignee: Stratasys, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Westman, Champlin & Koehler, P.A.
- Agent Peter J. Ims
- Main IPC: B29C64/245
- IPC: B29C64/245 ; B29C64/232 ; B33Y30/00 ; B29C64/118

Abstract:
A platen assembly for use with an extrusion-based 3D printer includes a grid assembly comprising at least a 4×2 framework of interlocked perpendicular x direction beams and y direction beams, providing a substantially planar upper surface and a bottom surface. The platen assembly includes a platen comprising a thin metal sheet supported on the upper surface of the grid assembly and secured to the grid assembly such that the top surface provides a substantially flat build surface. The x direction beams, the y direction beams and the platen are constructed of substantially a same thermal expansion properties, and wherein the build surface of the platen has a build surface area of at least 400 square inches and maintains its flatness to within a flatness tolerance of 0.020 inches over a temperature range of at least 20 C-300 C.
Public/Granted literature
- US20220001613A1 PLATEN WITH GRID ASSEMBLY FOR 3D PRINTING Public/Granted day:2022-01-06
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