An electronic paper package structure including a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier and a sealant is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The at least one water vapor barrier is disposed in the groove. The sealant is filled into the groove to cover the at least one water vapor barrier.