Invention Grant
- Patent Title: Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
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Application No.: US17671022Application Date: 2022-02-14
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Publication No.: US11908727B2Publication Date: 2024-02-20
- Inventor: Kunsil Lee , Seung Hwan Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20170122015 2017.09.21
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/56 ; H01L23/544 ; H01L23/31 ; H01L21/78
Abstract:
Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.
Public/Granted literature
Information query
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