Invention Grant
- Patent Title: Port mapping for bonded interfaces of ECMP group
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Application No.: US17880899Application Date: 2022-08-04
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Publication No.: US11909558B2Publication Date: 2024-02-20
- Inventor: Dexiang Wang , Jia Yu , Jayant Jain , Mike Parsa , Haihua Luo
- Applicant: VMware LLC
- Applicant Address: US CA Palo Alto
- Assignee: VMware LLC
- Current Assignee: VMware LLC
- Current Assignee Address: US CA Palo Alto
- Agency: Quarles & Brady LLP
- Main IPC: H04L12/18
- IPC: H04L12/18 ; H04L12/66 ; H04L9/40 ; H04L45/24 ; H04L49/25

Abstract:
Some embodiments of the invention provide novel methods for providing a stateful service at a network edge device (e.g., an NSX edge) that has a plurality of north-facing interfaces (e.g., interfaces to an external network) and a plurality of corresponding south-facing interfaces (e.g., interfaces to a logical network). A set of interfaces on each side of the network edge device for a set of equal cost paths, in some embodiments, are bonded together in the network edge device to correspond to a single interface on either side of a logical bridge including at least one logical switch providing a stateful service implemented by the network edge device. The bond is implemented, in some embodiments, by a bonding module executing on the network edge device that maintains a mapping between ingress and egress interfaces to allow deterministic forwarding through the network edge device in the presence of bonded interfaces.
Public/Granted literature
- US20220376952A1 PORT MAPPING FOR BONDED INTERFACES OF ECMP GROUP Public/Granted day:2022-11-24
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