A magnetic field sensor package includes a sensor housing; a first sensor chip having an integrated first differential magnetic field sensor circuit, the first sensor chip being arranged in the sensor housing; a second sensor chip having an integrated second differential magnetic field sensor circuit, the second sensor chip being arranged in the sensor housing; a common leadframe arranged in the sensor housing and interposed between the first sensor chip and the second sensor chip; and an insulating layer arranged in the sensor housing interposed between the first sensor chip and the common leadframe. The first sensor chip is coupled to the common leadframe via the insulating layer. Additionally, the insulating layer electrically insulates the first sensor chip from the common leadframe such that the first sensor chip and the second sensor chip are galvanically decoupled from each other.