Invention Grant
- Patent Title: Integrated circuit device and methods
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Application No.: US17815113Application Date: 2022-07-26
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Publication No.: US11915787B2Publication Date: 2024-02-27
- Inventor: Bo-Feng Young , Yu-Ming Lin , Shih-Lien Linus Lu , Han-Jong Chia , Sai-Hooi Yeong , Chia-En Huang , Yih Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G11C7/12
- IPC: G11C7/12 ; G06F30/39 ; G11C8/08

Abstract:
An integrated circuit (IC) device includes a substrate, and a memory array layer having a plurality of transistors. First through fourth gate contacts are arranged along a first axis, and coupled to underlying gates of the plurality of transistors. First through fifth source/drain contacts in the memory array layer extend along a second axis transverse to the first axis, and are coupled to underlying source/drains of the plurality of transistors. The gate contacts and the source/drain contacts are alternatingly arranged along the first axis. A source line extends along the first axis, and is coupled to the first and fifth source/drain contacts. First and second word lines extend along the first axis, the first word line is coupled to the first and third gate contacts, and the second word line is coupled to the second and fourth gate contacts.
Public/Granted literature
- US20220358978A1 INTEGRATED CIRCUIT DEVICE AND METHODS Public/Granted day:2022-11-10
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