Invention Grant
- Patent Title: Semiconductor and manufacturing method of the same
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Application No.: US18123736Application Date: 2023-03-20
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Publication No.: US11917815B2Publication Date: 2024-02-27
- Inventor: Hyosub Kim , Keunnam Kim , Dongoh Kim , Bongsoo Kim , Euna Kim , Chansic Yoon , Kiseok Lee , Hyeonok Jung , Sunghee Han , Yoosang Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190106645 2019.08.29
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L27/108 ; H01L23/528

Abstract:
A semiconductor device includes: an active region defined by a device isolation layer formed in a substrate; a word line configured to cross the active region, the word line extending in a first direction and being formed in the substrate; a bit line extending in a second direction perpendicular to the first direction on the word line; a first contact connecting the bit line to the active region; a first mask for forming the active region, the first mask being formed on the active region; and a second mask of which a height of a top surface thereof is greater than a height of a top surface of the active region, the second mask covering the word line, wherein the active region has a bar shape that extends to form an acute angle with respect to the first direction.
Public/Granted literature
- US20230232618A1 SEMICONDUCTOR AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2023-07-20
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