Invention Grant
- Patent Title: Single crystal semiconductor structure and method of manufacturing the same
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Application No.: US17352851Application Date: 2021-06-21
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Publication No.: US11923195B2Publication Date: 2024-03-05
- Inventor: Junhee Choi , Vladmir Matias , Joohun Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , iBeam Materials, Inc.
- Applicant Address: KR NM Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,iBeam Materials, Inc.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,iBeam Materials, Inc.
- Current Assignee Address: KR Suwon-si; US NM Santa Fe
- Agency: Sughrue Mion, PLLC
- Priority: KR 20210042231 2021.03.31
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A single crystal semiconductor includes a strain compensation layer; an amorphous substrate disposed on the strain compensation layer; a lattice matching layer disposed on the amorphous substrate and including two or more single crystal layers; and a single crystal semiconductor layer disposed on the lattice matching layer, the lattice matching layer including a direction control film disposed on the amorphous substrate and including a single crystal structure, and a buffer layer including a material different from that of the direction control film, the buffer layer being disposed on the direction control film and including a single crystal structure.
Public/Granted literature
- US20220285151A1 SINGLE CRYSTAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-09-08
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