- 专利标题： Systems and methods for producing parts at elevated temperatures
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申请号： US17517143申请日： 2021-11-02
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公开(公告)号： US11931932B2公开(公告)日： 2024-03-19
- 发明人: Kenneth J. Susnjara
- 申请人： Thermwood Corporation
- 申请人地址： US IN Dale
- 专利权人： Thermwood Corporation
- 当前专利权人： Thermwood Corporation
- 当前专利权人地址： US IN Dale
- 代理机构： Bookoff McAndrews, PLLC
- 主分类号： B29C43/36
- IPC分类号： B29C43/36 ; B29C35/02 ; B29C43/02 ; B29C64/10 ; B33Y10/00 ; B33Y80/00 ; B29K101/12
摘要：
A mold assembly for producing a part includes a first section, a second section movably coupled to the first section, and a cavity defined by the first section and the second section, the cavity being shaped to receive a part while the first section and the second section are movably coupled to each other. The mold assembly includes a joint formed by adjacent surfaces of the first section and the second section and a seal extending along the joint.
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