- 专利标题： Power and temperature management for functional blocks implemented by a 3D stacked integrated circuit
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申请号： US17408230申请日： 2021-08-20
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公开(公告)号： US11935869B2公开(公告)日： 2024-03-19
- 发明人: Tony M. Brewer
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Greenberg Traurig
- 主分类号： H01L27/06
- IPC分类号： H01L27/06 ; H01L25/065 ; H01L27/02 ; H10B12/00
摘要：
A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, a logic die, and a thermal management component. The non-volatile memory die, the volatile memory die, the logic die, and the thermal management component are stacked. The thermal management component can be stacked in between the non-volatile memory die and the logic die, stacked in between the volatile memory die and the logic die, or both.
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