发明授权
- 专利标题: Camera module
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申请号: US17752262申请日: 2022-05-24
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公开(公告)号: US11936969B2公开(公告)日: 2024-03-19
- 发明人: Se Yeon Hwang , Hyun Sang Kwak , Yeo Ok Jeon , Joon Woo Gi , Seok Hwan Kim
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: MORGAN, LEWIS & BOCKIUS LLP
- 优先权: KR 20210183629 2021.12.21
- 主分类号: H04N23/54
- IPC分类号: H04N23/54 ; H04N23/57 ; H05K1/18
摘要:
A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.
公开/授权文献
- US20230199291A1 CAMERA MODULE 公开/授权日:2023-06-22
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