Invention Grant
- Patent Title: Apparatus and methods for improving thermal chemical vapor deposition (CVD) uniformity
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Application No.: US16636659Application Date: 2018-08-10
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Publication No.: US11939675B2Publication Date: 2024-03-26
- Inventor: Rui Cheng , Karthik Janakiraman , Zubin Huang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Agent Keith Taboada
- International Application: PCT/US2018/046344 2018.08.10
- International Announcement: WO2019/033052A 2019.02.14
- Date entered country: 2020-02-05
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; C23C16/46

Abstract:
In one aspect, an apparatus includes a chamber body, a blocker plate for delivering process gases into a gas mixing volume, and a face plate having holes through which the mixed gas is distributed to a substrate. In another aspect, the face plate may include a first region with a recess relative to a second region. In another aspect, the blocker plate may include a plurality of regions, each region having different hole patterns/geometries and/or flow profiles. In another aspect, the apparatus may include a radiation shield disposed below a bottom of the substrate support. A shaft or stem of the substrate support includes holes at an upper end thereof near the substrate support.
Public/Granted literature
- US20210147981A1 APPARATUS AND METHODS FOR IMPROVING THERMAL CHEMICAL VAPOR DEPOSITION (CVD) UNIFORMITY Public/Granted day:2021-05-20
Information query
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