- Patent Title: Panel interconnectable with similar panels for forming a covering
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Application No.: US17730922Application Date: 2022-04-27
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Publication No.: US11946261B2Publication Date: 2024-04-02
- Inventor: Eddy Alberic Boucké , Johan Christiaan Rietveldt
- Applicant: I4F Licensing NV
- Applicant Address: BE Hamont-Achel
- Assignee: i4F Licensing NV
- Current Assignee: i4F Licensing NV
- Current Assignee Address: BE Turnhout
- Agency: The Webb Law Firm
- Priority: WO TNL2014050118 2014.02.26 BY 0150107 2015.02.23
- Main IPC: E04B2/00
- IPC: E04B2/00 ; E04F15/02 ; E04F15/10
Abstract:
The invention relates to a panel, in particular a floor panel, interconnectable with similar panels for forming a covering. The invention also relates to a covering consisting of mutually connected floor panels according to the invention. The invention further relates to a method of assembling multiple floor panels for forming a covering.
Public/Granted literature
- US20220251853A1 Panel Interconnectable with Similar Panels for Forming a Covering Public/Granted day:2022-08-11
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