Invention Grant
- Patent Title: Bounding box estimation and lane vehicle association
-
Application No.: US18045101Application Date: 2022-10-07
-
Publication No.: US11948249B2Publication Date: 2024-04-02
- Inventor: Young-Ki Baik , ChaeSeong Lim , Duck Hoon Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C./Qualcomm Incorporated
- Main IPC: G06T17/10
- IPC: G06T17/10 ; G05D1/00 ; G06T7/70 ; G06T7/73

Abstract:
Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
Public/Granted literature
- US20230135153A1 BOUNDING BOX ESTIMATION AND LANE VEHICLE ASSOCIATION Public/Granted day:2023-05-04
Information query