- 专利标题： High power electrostatic chuck design with radio frequency coupling
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申请号： US17985764申请日： 2022-11-11
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公开(公告)号： US11948826B2公开(公告)日： 2024-04-02
- 发明人: Jaeyong Cho , Vijay D. Parkhe , Haitao Wang , Kartik Ramaswamy , Chunlei Zhang
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 分案原申请号： US15383035 2016.12.19
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; C23C16/458 ; C23C16/46 ; C23C16/505 ; H01J37/32
摘要：
An electrostatic chuck is described that has radio frequency coupling suitable for use in high power plasma environments. In some examples, the chuck includes a base plate, a top plate, a first electrode in the top plate proximate the top surface of the top plate to electrostatically grip a workpiece, and a second electrode in the top plate spaced apart from the first electrode, the first and second electrodes being coupled to a power supply to electrostatically charge the first electrode.
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