Invention Grant
- Patent Title: Vane multiplet with conjoined singlet vanes
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Application No.: US17882041Application Date: 2022-08-05
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Publication No.: US11952917B2Publication Date: 2024-04-09
- Inventor: David J. Wasserman , Raymond Surace
- Applicant: RAYTHEON TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: RTX CORPORATION
- Current Assignee: RTX CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: F01D25/00
- IPC: F01D25/00 ; F01D9/04

Abstract:
A vane multiplet includes first and second ceramic matrix composite (CMC) singlet vanes that are arranged circumferentially adjacent each other. Each of the CMC singlet vanes includes an airfoil section and a platform at one end of the airfoil section. The platform defines forward and trailing platform edges and first and second circumferential side edges. A CMC overwrap conjoins the CMC singlet vanes. The CMC overwrap includes fiber plies that are fused to the platforms of the CMC singlet vanes.
Public/Granted literature
- US20240044258A1 VANE MULTIPLET WITH CONJOINED SINGLET VANES Public/Granted day:2024-02-08
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