- 专利标题: Method for coating chips
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申请号: US17435102申请日: 2020-03-02
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公开(公告)号: US11955585B2公开(公告)日: 2024-04-09
- 发明人: Aurélien Suhm , Maxime Argoud
- 申请人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 申请人地址: FR Paris
- 专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人地址: FR Paris
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: FR 02486 2019.03.12
- 国际申请: PCT/FR2020/050410 2020.03.02
- 国际公布: WO2020/183090A 2020.09.17
- 进入国家日期: 2021-08-31
- 主分类号: H01L33/44
- IPC分类号: H01L33/44 ; G03F7/11 ; G03F7/16
摘要:
A method for coating chips resting, by a rear face opposite to a front face, on a main face of a support substrate, and separated from each other by an inter-chip space, includes a step of forming a photosensitive coating film covering the front faces and the inter-chip spaces. The method further includes a first photolithographic sequence which comprises an insolation sub-step, and a dissolution sub-step. The sequence leads to a partial removal of the photosensitive coating film so as to maintain the film exclusively at the inter-chip spaces and, advantageously recessed relative to the front faces.
公开/授权文献
- US20220149245A1 METHOD FOR COATING CHIPS 公开/授权日:2022-05-12
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