Invention Grant
- Patent Title: Flexible substrate
-
Application No.: US17450857Application Date: 2021-10-14
-
Publication No.: US11956893B2Publication Date: 2024-04-09
- Inventor: Takumi Sano
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP 19086164 2019.04.26
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.
Public/Granted literature
- US20220039248A1 FLEXIBLE SUBSTRATE Public/Granted day:2022-02-03
Information query