A polyethylene homopolymer composition comprises: a first ethylene homopolymer having a density, d1 of from 0.930 to 0.975 g/cm3, a melt index, I21 of from 0.01 to 10 g/10 min, and a molecular weight distribution, Mw/Mn of less than 2.5; and a second ethylene homopolymer having a density, d2 of from 0.945 to 0.980 g/cm3, a melt index, I22 of at least 1.0 g/10 min, and a molecular weight distribution, Mw/Mn of less than 2.5; wherein melt index, I22 of the second ethylene homopolymer is greater than the melt index, I21 of the first ethylene homopolymer. The polyethylene homopolymer compositions which may be nucleated have a weight average molecular weight, Mw of ≤75,000, a molecular weight distribution, Mw/Mn of less than 4.0 and may be usefully employed in molding applications, such as, for example, in compression molded closures.