- 专利标题: Sintered material, connection structure, composite particle, joining composition, and method for manufacturing sintered material
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申请号: US16485558申请日: 2018-02-20
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公开(公告)号: US11961815B2公开(公告)日: 2024-04-16
- 发明人: Hiroyuki Nomoto , Masao Sasadaira
- 申请人: SEKISUI CHEMICAL CO., LTD.
- 申请人地址: JP Osaka
- 专利权人: SEKISUI CHEMICAL CO., LTD.
- 当前专利权人: SEKISUI CHEMICAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP 17029143 2017.02.20
- 国际申请: PCT/JP2018/005923 2018.02.20
- 国际公布: WO2018/151313A 2018.08.23
- 进入国家日期: 2019-08-13
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; B22F1/065 ; B22F1/0655 ; B22F1/10 ; B22F1/17 ; B22F1/18 ; B22F3/10 ; B22F3/11
摘要:
A sintered material excellent in thermal stress and bonding strength; a connection structure containing the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material has a base portion, buffer portions, and filling portions. The buffer portions and filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from a pore and/or material that is not the same as the sintered body, and each filling portion is formed from particles and/or fibers. The sintered material satisfies A>B. A is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material. B is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material from which the filling portions are removed.
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