Invention Grant
- Patent Title: Module
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Application No.: US17651273Application Date: 2022-02-16
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Publication No.: US11961830B2Publication Date: 2024-04-16
- Inventor: Yoshihito Otsubo , Motohiko Kusunoki , Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-fu
- Agency: Pearne & Gordon LLP
- Priority: JP 19153116 2019.08.23 JP 20122292 2020.07.16
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L25/16 ; H01L23/498

Abstract:
A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.
Public/Granted literature
- US20220173085A1 MODULE Public/Granted day:2022-06-02
Information query
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