- 专利标题: Low-profile backrail module clamp
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申请号: US17805010申请日: 2022-06-01
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公开(公告)号: US11962269B2公开(公告)日: 2024-04-16
- 发明人: Lucas Creasy , Nathan Schuknecht , Benjamin C. de Fresart
- 申请人: ARRAY TECHNOLOGIES, INC.
- 申请人地址: US NM Albuquerque
- 专利权人: ARRAY TECHNOLOGIES, INC.
- 当前专利权人: ARRAY TECHNOLOGIES, INC.
- 当前专利权人地址: US NM Albuquerque
- 代理机构: MASCHOFF BRENNAN
- 主分类号: H02S30/00
- IPC分类号: H02S30/00 ; B21D28/26 ; B25B5/16 ; H02S20/32
摘要:
A method of forming a module clamp of a photovoltaic module support structure may include cutting a folding pattern into a sheet of metal. The folding pattern may include one or more width-wise slits relative to the sheet of metal, one or more length-wise slits relative to the sheet of metal, and a hole. The method may include stamping one or more first features onto the sheet of metal to form a stamped sheet and folding the stamped sheet along the one or more width-wise slits and the one or more length-wise slits to form a preliminary module clamp. The method may include stamping one or more second features onto the preliminary module clamp to form the module clamp.
公开/授权文献
- US20220294386A1 LOW-PROFILE BACKRAIL MODULE CLAMP 公开/授权日:2022-09-15
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