- Patent Title: Back-end active device, semiconductor device and semiconductor chip
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Application No.: US17674858Application Date: 2022-02-18
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Publication No.: US11963365B2Publication Date: 2024-04-16
- Inventor: Yun-Feng Kao , Katherine H Chiang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H10B51/40
- IPC: H10B51/40 ; G11C11/22 ; H01L29/417 ; H01L29/423 ; H01L29/51 ; H01L29/78 ; H03K19/20 ; H10B51/10 ; H10B51/30

Abstract:
An active device, a semiconductor device and a semiconductor chip are provided. The active device includes: a channel layer; a top source/drain electrode, disposed at a top side of the channel layer; a first bottom source/drain electrode and a second bottom source/drain electrode, disposed at a bottom side of the channel layer; a first gate structure and a second gate structure, located between the top source/drain electrode and the first bottom source/drain electrode, wherein the first gate structure comprises a non-ferroelectric dielectric layer, and the second gate structure comprises a ferroelectric layer; and a third gate structure and a fourth gate structure, located between the top source/drain electrode and the second bottom source/drain electrode, wherein the third gate structure comprises a non-ferroelectric dielectric layer, and the fourth gate structure comprises a ferroelectric layer.
Public/Granted literature
- US20230269948A1 BACK-END ACTIVE DEVICE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP Public/Granted day:2023-08-24
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