- 专利标题： Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus
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申请号： US17857289申请日： 2022-07-05
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公开(公告)号： US11964357B2公开(公告)日： 2024-04-23
- 发明人: Seungchul Han , Yonghee Lee , Taemin Earmme , Byoungho Kwon , Kuntack Lee
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR
- 代理机构： Fish & Richardson P.C.
- 优先权： KR 20190051237 2019.05.02
- 分案原申请号： US16662439 2019.10.24
- 主分类号： B24B37/005
- IPC分类号： B24B37/005 ; B24B37/20
摘要：
A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.
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