Invention Grant
- Patent Title: Packaging structure of a magnetic device
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Application No.: US17140143Application Date: 2021-01-04
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Publication No.: US11967446B2Publication Date: 2024-04-23
- Inventor: Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agent Min-Lee Teng
- Main IPC: H01F27/25
- IPC: H01F27/25 ; H01F1/147 ; H01F17/04 ; H01F27/02 ; H01F27/255 ; H01F27/28 ; H01F27/29

Abstract:
An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
Public/Granted literature
- US20210125767A1 Packaging Structure of a Magnetic Device Public/Granted day:2021-04-29
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