- 专利标题: Multi-layer ceramic electronic component and circuit board including the same
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申请号: US17894535申请日: 2022-08-24
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公开(公告)号: US11967467B2公开(公告)日: 2024-04-23
- 发明人: Fumi Mori , Daisuke Iwai , Shinichi Sasaki
- 申请人: TAIYO YUDEN CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Law Office of Katsuhiro Arai
- 优先权: JP 21152358 2021.09.17
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G2/06 ; H01G4/008 ; H01G4/012
摘要:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a plurality of internal electrodes laminated in one axial direction, and an end surface extending along a plane parallel to the axial direction, at least part of the plurality of internal electrode being drawn from the end surface. The external electrode covers the end surface of the ceramic body. In a thermal desorption spectrum of water of the multi-layer ceramic electronic component by thermal desorption spectroscopy, a ratio P1/P2 of a detection intensity P1 of a first peak in a range of 200° C. to 300° C. to a detection intensity P2 of a second peak in a range of 550° C. to 800° C. is equal to or lower than 11.
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