Invention Grant
- Patent Title: Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
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Application No.: US17555107Application Date: 2021-12-17
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Publication No.: US11967569B2Publication Date: 2024-04-23
- Inventor: Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Valerie M. Davis; Frank D. Cimino
- The original application number of the division: US16592102 2019.10.03
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/66 ; H01L49/02 ; H01Q1/22
Abstract:
A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
Public/Granted literature
- US20220108960A1 EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS Public/Granted day:2022-04-07
Information query
IPC分类:
