- 专利标题: Polyimide precursor, polyimide precursor composition, polyimide film, manufacturing method thereof, and use thereof
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申请号: US17412755申请日: 2021-08-26
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公开(公告)号: US11970578B2公开(公告)日: 2024-04-30
- 发明人: Min Seon Jung , Hyo Shin Kwak , Joo Hyun Lee
- 申请人: SK Innovation Co., Ltd. , SK ie technology Co., Ltd.
- 申请人地址: KR Seoul
- 专利权人: SK Innovation Co., Ltd.,SK ie technology Co., Ltd.
- 当前专利权人: SK Innovation Co., Ltd.,SK ie technology Co., Ltd.
- 当前专利权人地址: KR Seoul; KR Seoul
- 代理机构: The Webb Law Firm
- 优先权: KR 20200113020 2020.09.04
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; C08J5/18
摘要:
The present invention relates to a polyimide precursor, a polyimide precursor solution, a polyimide film, a manufacturing method thereof, and a use thereof. The polyimide precursor according to the present invention may provide a polyimide film that has excellent heat resistance and satisfies transparency and a low coefficient of linear thermal expansion, and thus the polyimide film will be usefully applicable in the field of flexible displays requiring high dimensional stability.
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