- 专利标题: Reduced pitch memory subsystem for memory device
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申请号: US18083445申请日: 2022-12-16
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公开(公告)号: US11973031B2公开(公告)日: 2024-04-30
- 发明人: Michael A. Smith , Haitao Liu , Vladimir Mikhalev
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Perkins Coie LLP
- 分案原申请号: US16986776 2020.08.06
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L21/8238 ; H01L27/092 ; H01L29/66 ; H01L29/78 ; H10B10/00
摘要:
A memory device includes an array of memory cells and a plurality of bit-lines with each bit-line connected to a respective set of memory cells of the array of memory cells. The memory device includes a memory subsystem having first and second memory circuits. Each first memory circuit can be disposed laterally adjacent to a second memory circuit. Each first memory circuit includes a first bit-line connection and each second memory circuit including a second bit-line connection, the first and second bit-line connections can connect to respective bit-lines. Each first bit-line connection is disposed on a first bit-line connection line of the memory subsystem and each second bit-line connection is disposed on a second bit-line connection line of the memory subsystem, and the second bit-line connection line can be offset from the first bit-line connection line by a predetermined distance that is greater than zero.
公开/授权文献
- US20230123487A1 REDUCED PITCH MEMORY SUBSYSTEM FOR MEMORY DEVICE 公开/授权日:2023-04-20
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