- 专利标题: Source or drain structures for germanium N-channel devices
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申请号: US16368088申请日: 2019-03-28
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公开(公告)号: US11973143B2公开(公告)日: 2024-04-30
- 发明人: Ryan Keech , Benjamin Chu-Kung , Subrina Rafique , Devin Merrill , Ashish Agrawal , Harold Kennel , Yang Cao , Dipanjan Basu , Jessica Torres , Anand Murthy
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L21/84
- IPC分类号: H01L21/84 ; H01L21/02 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/167 ; H01L29/45 ; H01L29/66 ; H01L29/78
摘要:
Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.
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