Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17548707Application Date: 2021-12-13
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Publication No.: US11974467B2Publication Date: 2024-04-30
- Inventor: Kenta Kajiyama , Masakazu Kaida
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 15087356 2015.04.22
- Main IPC: H10K59/123
- IPC: H10K59/123 ; H10K59/124 ; H10K59/12

Abstract:
A display device and manufacturing method thereof with a high level of reliability is provided without increasing the number of manufacturing processes. The display device includes a first conductor, a first insulation layer including a first contact hole exposing a part of the first conductor, a second insulation layer including a second contact hole exposing at least a part of the first contact hole and a part of a surface of the first insulation layer, a pixel electrode overlapping a part of the second contact hole and electrically connected to the first conductor, and a third insulation layer contacting the first insulation layer via the second contact hole.
Public/Granted literature
- US20220102451A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-31
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