- 专利标题: Chip protective film and method for manufacturing same, and chip
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申请号: US18459006申请日: 2023-08-30
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公开(公告)号: US11978686B2公开(公告)日: 2024-05-07
- 发明人: De Wu , Shuhang Liao , Liu Zhang , Junxing Su
- 申请人: Wuhan Choice Technology Co, Ltd
- 申请人地址: CN Wuhan
- 专利权人: Wuhan Choice Technology Co, Ltd.
- 当前专利权人: Wuhan Choice Technology Co, Ltd.
- 当前专利权人地址: CN Wuhan
- 代理商 Nitin Kaushik
- 优先权: CN 2210784970.X 2022.07.06
- 主分类号: H01L23/29
- IPC分类号: H01L23/29 ; H01L21/56
摘要:
Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.
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