Invention Grant
- Patent Title: Plasma chamber and chamber component cleaning methods
-
Application No.: US17562467Application Date: 2021-12-27
-
Publication No.: US11984306B2Publication Date: 2024-05-14
- Inventor: Rajinder Dhindsa , Linying Cui , James Rogers
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/02
Abstract:
Embodiments provided herein generally include plasma processing systems configured to preferentially clean desired surfaces of a substrate support assembly by manipulating one or more characteristics of an in-situ plasma and related methods. In one embodiment, a plasma processing method includes generating a plasma in a processing region defined by a chamber lid and a substrate support assembly, exposing an edge ring and a substrate supporting surface to the plasma, and establishing a pulsed voltage (PV) waveform at the edge control electrode.
Public/Granted literature
- US20220399194A1 PLASMA CHAMBER AND CHAMBER COMPONENT CLEANING METHODS Public/Granted day:2022-12-15
Information query
