Invention Grant
- Patent Title: Apparatus and methods for semiconductor processing
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Application No.: US18095827Application Date: 2023-01-11
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Publication No.: US11984343B2Publication Date: 2024-05-14
- Inventor: Joseph Yudovsky , Kaushal Gangakhedkar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- The original application number of the division: US15927066 2018.03.20
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/455 ; C23C16/458 ; C23C16/46 ; C23C16/50 ; H01L21/687
Abstract:
Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.
Public/Granted literature
- US20230146344A1 APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING Public/Granted day:2023-05-11
Information query
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