- 专利标题： Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same
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申请号： US18486637申请日： 2023-10-13
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公开(公告)号： US11984391B1公开(公告)日： 2024-05-14
- 发明人: Anuya Reddy , Lyle Looney , Darshan Shah
- 申请人： Auradine, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Auradine, Inc.
- 当前专利权人： Auradine, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson P.C.
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/367 ; H05K3/00 ; H05K3/30
摘要：
A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A method for circuit board assembly is also provided.
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