Invention Grant
- Patent Title: Fingerprint sensor and manufacturing method thereof
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Application No.: US17867287Application Date: 2022-07-18
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Publication No.: US11990435B2Publication Date: 2024-05-21
- Inventor: Sung Sun Park , Ji Young Chung , Christopher Berry
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR 20150065900 2015.05.12
- Main IPC: G06V40/13
- IPC: G06V40/13 ; B81C3/00 ; H01L23/00 ; H01L23/053 ; H01L23/31

Abstract:
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
Public/Granted literature
- US20230009679A1 FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-01-12
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