- 专利标题: Electronic device including heat dissipation structure
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申请号: US17713438申请日: 2022-04-05
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公开(公告)号: US11991816B2公开(公告)日: 2024-05-21
- 发明人: Yongyoun Kim , Chanhee Oh , Dongkee Jung
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Cha & Reiter, LLC
- 优先权: KR 20210044838 2021.04.06
- 主分类号: G06F1/16
- IPC分类号: G06F1/16 ; H01Q1/02 ; H01Q5/25 ; H01Q9/04 ; H05K1/02 ; H02J50/20
摘要:
According to various embodiments of the disclosure, an electronic device may include a housing, a non-conductive supporting member disposed in the housing and including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area, a conductive pattern portion disposed over the first area of the supporting member, a heat dissipation member disposed to at least partially overlap the conductive pattern portion, and an antenna including a circuit board, a conductive portion, and a ground portion. The conductive portion of the antenna may be disposed over the second area. The heat dissipation member may extend from the first area to the third area, and the ground portion of the antenna may extend from the second area to the third area to contact at least a portion of the heat dissipation member.
公开/授权文献
- US20220322516A1 ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE 公开/授权日:2022-10-06
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