Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US17844344Application Date: 2022-06-20
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Publication No.: US11996444B2Publication Date: 2024-05-28
- Inventor: Guk Hwan Kim
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR 20200040312 2020.04.02
- The original application number of the division: US16928307 2020.07.14
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/02 ; H01L29/40 ; H01L29/417 ; H01L29/423

Abstract:
A semiconductor device includes a source region, a drain region, and a gate insulating film formed on a substrate, a gate electrode formed on the gate insulating film, a first insulating film pattern formed to extend from the source region to a part of a top surface of the gate electrode, and a spacer formed on a side surface of the gate electrode in a direction of the drain region.
Public/Granted literature
- US20220328619A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2022-10-13
Information query
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