- 专利标题: Semiconductor device
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申请号: US17568421申请日: 2022-01-04
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公开(公告)号: US11996475B2公开(公告)日: 2024-05-28
- 发明人: Masakazu Baba , Shinsuke Harada
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kawasaki
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kawasaki
- 代理机构: Rabin & Berdo, P.C.
- 优先权: JP 21000963 2021.01.06
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/06 ; H01L29/16 ; H01L29/417 ; H01L29/423 ; H01L29/47 ; H01L29/49
摘要:
One object is to provide a semiconductor device capable of reducing loss during turn-on and degradation of forward voltage. A vertical MOSFET includes a semiconductor substrate 2 of a first conductivity type, a first semiconductor layer 1 of the first conductivity type, a second semiconductor layer 16 of a second conductivity type, first semiconductor regions 17 of the first conductivity type, first trenches 31 and a second trench 32, gate electrodes 20 provided in the first trenches 31 via a gate insulating film 19, and a Schottky electrode 29 provided in the second trench 32. The first trenches 31 are provided in a striped pattern, in a plan view and the second trench 32 surrounds the first trenches 31.
公开/授权文献
- US20220216334A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-07-07
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