Disclosed herein is a film cutting system for dividing and forming a film sheet having a predetermined unit width and unit length from a raw film by laser cutting of the raw film. The film cutting system includes: a supply unit configured to intermittently supply the raw film by a predetermined unit supply length in a length direction of the raw film; a first laser unit including first and second laser nozzles each configured to radiate a laser beam onto the raw film, and a first head driver configured to convey the first laser nozzle and the second laser nozzle in a width direction of the raw film perpendicular to the length direction in a reciprocating manner; and a second laser unit including a laser nozzle disposed spaced apart from the first laser unit by the unit length in the length direction and configured to radiate a laser beam onto the raw film, and a second head driver configured to convey the laser nozzle in the width direction in a reciprocating manner, wherein, when the raw film is supplied by the supply unit, the first head driver dispose the first laser nozzle and the second laser nozzle so as to be spaced apart from each other by the unit width, and each of the first laser nozzle and the second laser nozzle radiates, in the length direction, the laser beam onto the raw film supplied by the supply unit to slit the raw film, and wherein, when the slitting of the raw film is completed, the supply unit stops supplying the raw film; the first head driver conveys one of the first laser nozzle and the second laser nozzle in the width direction; the second head driver conveys the laser nozzle in the width direction; and the one of the first laser nozzle and the second laser nozzle and the laser nozzle respectively radiate the laser beam onto the raw film in the width direction to cut the raw film to divide and form the film sheet from the raw film.