- 专利标题： Acoustic device thermoforming
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申请号： US17074090申请日： 2020-10-19
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公开(公告)号： US12000140B2公开(公告)日： 2024-06-04
- 发明人: Jonathan Wesley McGee , Cathlyn Newell , Zackery Belanger
- 申请人： The Regents of the University of Michigan
- 申请人地址： US MI Ann Arbor
- 专利权人： The Regents of the University of Michigan
- 当前专利权人： The Regents of the University of Michigan
- 当前专利权人地址： US MI Ann Arbor
- 代理机构： Lempia Summerfield Katz LLC
- 主分类号： E04B1/84
- IPC分类号： E04B1/84 ; B26F1/26 ; C03B23/025 ; G10K11/162
摘要：
A method of fabricating an acoustic device includes forming a plurality of holes in a panel, disposing the panel in a support frame, and heating the panel to a temperature such that the panel sags while disposed in the support frame and each hole of the plurality of holes is modified.
公开/授权文献
- US20210115664A1 ACOUSTIC DEVICE THERMOFORMING 公开/授权日：2021-04-22
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