A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.