Invention Grant
- Patent Title: VoIP and native carrier call integration
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Application No.: US17317881Application Date: 2021-05-11
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Publication No.: US12010601B2Publication Date: 2024-06-11
- Inventor: Steven Paul Papa , Rajesh Kumar Mishra , Kaitki Agarwal
- Applicant: Parallel Wireless, Inc.
- Applicant Address: US NH Nashua
- Assignee: Parallel Wireless, Inc.
- Current Assignee: Parallel Wireless, Inc.
- Current Assignee Address: US NH Nashua
- Agent Michael Y. Saji
- Main IPC: H04W40/02
- IPC: H04W40/02 ; H04W4/16 ; H04W4/18 ; H04W88/16

Abstract:
Systems, methods and computer software are disclosed for providing a Diameter multifold message. In one embodiment a method is disclosed, comprising: providing a multifold-command Attribute Value Pair (AVP), the multifold-command AVP including an AVP code, a set of VMP flags, an AVP length and a vendor ID; including the AVP in a Capabilities Exchange Request (CER) command for a Diameter stack supporting multiplexing of commands in one message; and using the AVP to combine messages from multiple applications running on a single Diameter node and multiple commands from a single application.
Public/Granted literature
- US20210266813A1 VoIP and Native Carrier Call Integration Public/Granted day:2021-08-26
Information query