A cutting processing apparatus includes a cutting tool, a chuck portion, a feed mechanism, a fixing portion that fixes the cutting object, a stage that moves the fixing portion at a processing speed in a direction substantially orthogonal to a rotation axis of the chuck portion, a sensor that is arranged in the vicinity of a position on the fixing portion at which the cutting object is fixed, detects vibration of the cutting tool during cutting processing of the cutting object, and outputs a monitoring signal, and a control circuit that converts time waveform data of the monitoring signal to frequency waveform data and extracts an impact amount during cutting processing of the cutting object from the frequency waveform data.