Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17858370Application Date: 2022-07-06
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Publication No.: US12020868B2Publication Date: 2024-06-25
- Inventor: Min Gon Lee , Seung Woo Song , Jae Yeol Choi , Jin Kyung Joo , Taek Jung Lee , Jin Man Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180046195 2018.04.20 KR 20180090639 2018.08.03
- The original application number of the division: US16170499 2018.10.25
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/12 ; H01G4/224 ; H01G4/30 ; H01G4/012

Abstract:
A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
Public/Granted literature
- US20220351909A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-11-03
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